What is NEMS? (Abbreviation for nanoelectric systems) or Nano electronical systems (PhD in nano-microelectronics)
Researcher and author: Dr. ( Afshin Rashid)
Note: Different MEMS and NEMS should be designed according to the specifications, needs, goals and applications. MEMS and NEMS have evolved into electromechanical and mechanical electron electronics. Typically, optical systems are faster, simpler, more efficient, more reliable, and more durable than electromechanical systems.
Although optical systems are designed for different applications (eg, communications, calculations, and wireless switching, etc.), they have different configurations, it is generally very difficult to make a comparative comparison between them. Optical systems, for example , cannot be used as stimuli . Applied needs must be taken into account, and electromagnetic connections, temperature, vibration, or radiation can be better factors for construction. As another example, we look at nano- and micro-scale stimuli. The size of the actuator depends on the amount of force or torque that is a function of the material used and its size (volume). In fact, the size with the required force and torque and its gender Determined. It is very important to integrate electromagnetic MEMS, microstructures or micro-transduces that are controlled by ICs used in micro-radiative energy devices. Thus, microstructures and microstrans diodes, radiant energy devices, and ICs must be integrated. Direct chip connection technology has advanced extensively. In particular, the chip-flip MEMS suite was replaced with wired tape to connect the ICs to the micro-nano-scale actuators and sensors. The use of chip-flip technology allows the removal of inductors, capacitors and noise resistors.
This leads to the modification of the device specifications. Continuing chip-flip integration leads to the benefits of implementing advanced flexible packages, reliable improvements and weight and size reductions, and so on. Integrated chip-flip Microtransducers can be mounted with protrusions and downwards on layers mounted on electromechanical devices and attached to the IC base. MEMS Large-scale integrated MEMS (a chip that can be mass-produced) And at a low cost used in COMS.
Researcher and author: Dr. ( Afshin Rashid)
PhD in Nano-Microelectronics