_ Understanding ( Micro BGA ICs) or (Micro Ball Base)
How to rework (template micro BGA) and refurbish micro BGA or micro ball sockets
Researcher and writer: ( Afshin Rashid)
Note: SMD stencil is used for reballing and reballing ball base ICs (under the base) or micro BGA. Tin paste from the perfectly arranged stencil holes (holes) allows the damaged IC bases to function again in the circuit. To stencil BGA ic you need a hot air iron or (heater).
To rework and reball ball-base ICs (under the base) or micro BGA, tin paste, taking into account its softness within the standard range, is transferred onto the stencil using a metal spatula (with the ability to define the amount of pressure and range of motion), through the holes embedded in the SMD stencil onto the micro BGA IC.
The increase in the number of inputs and outputs in ICs has caused the dimensions of the IC to increase. In order to increase the number of pins and reduce the dimensions of the IC, micro BGA technology is used. This chip model can be rebuilt or reballed. In this method, instead of the IC pins being around it, they are under the IC. Solder is used in the form of balls in the pins, which are soldered to the board after assembly.
Micro BGA ICs can be easily reused by stenciling. This chip model is a type of SMD IC that is used in many electronic devices such as mobile phones and telecommunications equipment, computer motherboards and many other electronic boards. Because this IC does not have a base, which means it does not have a hard base like other DIP or SMD ICs, and its bases are made of tin and these bases are located exactly at the bottom of the IC; to replace it, we need a heater device; for this we use an air heater, but for sensitive chips such as motherboards, an infrared heater can be used.