Nanoelectronics) Principles of construction and classification of NEMSs

( Nanoelectronics) Principles of construction and classification of NEMSs (PhD in Micro _ Nanoelectronics)

Researcher  and author: Dr.   (   Afshin Rashid)

tip; NEMS  through nanoelectronics in systems that are classified  for defense, pharmaceutical, medical, electronic and telecommunication applications, etc. NEMS  current that includes acceleration  gauges are, chip display projection, the drone sensors, optical switches, Microvalve and multi-functional biosensors and micro-chips used in nano-volumes are produced. 

NEMSs  are integrated into moving microstructures (with electromechanical components ), sensors, actuators, radiation energy devices,  and microelectronics. These N EMSs can be built for use in various microstructure technologies such as micromachines . Basic technology in the construction of  NEMS  , CMOS  and biCOMS (for the construction of ICs) and  micro-machines (for the production of motion and radiation and energy radiation to devices and structures ). This is one of the main objectives of  microelectronic devices and structures with make-up  machines, electro-mechanical, not complex  to  NEMS  are integrated and high-efficiencyکردن. To ensure high performance, workability, reliability and buildability,  bulk manufacturing processes  based on CMOS are well developed and should be modified and enhanced.

Micro-up (Micromachining (the trunk (BULK, (plus Fnavy of the upper case (  , (LIGA-like and LIGA) or) high - aspect ratio  most developed methods of construction. Silicon  material below the initial layer is the industry  microelectronics A number of crystal molds (  solid 300 mm diameter and 100 mm long) are crystallized from very high purity silicon and cut to the desired thickness and then  polished by mechanical and chemical polishing technologies  . electromagnetic and mechanical direction and crystallized the crystals and  impurities predicted it.  depending on the layer of silicon CMOS processes and biCMOS for ICs are used to produce and processes are classified as: n-well-n, well-p (well-p) or well-twin. The main steps are: diffusion (oxidation ). , (Polysilicon,  photolithography), gate formations Masking, etching, metallization, wire bonding, etc.

Conclusion : 

NEMS  through nanoelectronics in systems that are classified  for defense, pharmaceutical, medical, electronic and telecommunication applications, etc. NEMS  current that includes acceleration  gauges are, chip display projection, the drone sensors, optical switches, Microvalve and multi-functional biosensors and micro-chips used in nano-volumes are produced. 

Researcher  and author: Dr.   (   Afshin Rashid)

PhD in Nano-Microelectronics