Nanoelectro Systems (  NEMS  ) The integration  of nanoelectric elements, sensors, actuators, and nanoelectronic  devices on a silicon basis by micron-sized manufacturing technology  (PhD in Nano-Microelectronics)

Researcher  and author: Dr.   (   Afshin Rashid)



Note: Recent trends in nanoelectronics engineering and science have focused on emphasizing the  combination, analysis, and control of advanced MEMS and NEMS The processes of composition, design and optimization are in fact evolutionary over natural samples 

At each level of the design hierarchy, the efficiency of the  system in the realm of its behavior is used to evaluate, optimize, and  correct the optimization and composition process to find new solutions. ICs must meet  the performance characteristics of MEMS, such as electromagnetic-based electromechanical devices and  structures , input-output channels, analog-to-digital conversions,  and analog-to-analog data. Micro-electro-mechanical systems (MEMS, (complex  of mechanical elements, sensors, actuators and components  electronic silicone-based technology by  building about the size of microns. As long as the devices  for electronic circuits for use in processIntegrated ICs (such as component processes  ), "BICMOS, Bipolar, CMOS micromechanical fabrication " for use in micro- machining processes,  suitable  for selectively adding layer by layer with silica  tablets  new building for shaping  devices mechanical and electromechanical used,  are made.  MEMS promises to revolutionize modern in the field of  integrated silicon-based technology,  microelectronics and micro are not, that  in order to make possible the full realization of "systems In  a "chip". 



MEMS is a technology that allows the development of intelligent products  , complementing the computing power of microelectrons, taking into account the capabilities of microsensors and  micromotors, and the development of possible design and  use space. Microelectronic integrated circuits can be considered as  the mastermind of a system, and MEMS  has enhanced this decision-making capability with eyes and arms  to allow microsystems to measure the environment  by mechanical, temperature, biological, chemical, They collect light and magnetism. The electronics then display information taken from the sensors and through some decisions to the arms to react  by moving, stabilizing the position, Commands setting, pumping and filtering As a result, the environment is controlled for the desired demands  Because MEMS devices are built for use in group manufacturing methods  such as integrated circuits , new levels of performance, reliability, and skill can be achieved on a small silicon chip  at a relatively low cost and low  MEMS availability.  Different specifications should be designed according to the  needs, purposes and applications:  MEMS and NEMS Electromechanical or mechanical electronics  have been developed.



Usually "system of  optical faster, easier and more efficient, more reliable and  more durable than electromechanical systems are. If what optical systems for various applications  are designed (such as communications, computing and  switching, wireless, etc.), configurations  different in general, it is very difficult that  a comparative study between them do. for example,  the optical system can not be used as stimuli to be applied. requirements Applications must be counted and  fittings, electromagnetic, temperature, vibration or  radiation The factors used to  build can be better: the  size of the actuator to the mass of force or torque that is a function of the material Used and its size (volume) depends. In fact, the size is determined by the required force and torque and its gender  The fact that electromagnetic MEMS, microstructures or Micro Trans Dyvsdhayy with IC used in Myykrv radiant energy devices  are controlled, are complex, very important is. Thus, microstructures and microstransmitters , radiant energy devices, and ICs must be  integrated. Direct chip connection  technology has advanced extensively. In particular, the chip-flip MEMS suite  was replaced with wired tape to connect the ICs to the  micro-nanostroke actuators and sensors. Using chip-flip technology, the possibility of removing inductors and Provides capacitors and noise resistance. This  leads to the modification of the device specifications. Continuing chip-flip integration leads to the benefits of implementing advanced flexible packages , reliable improvements and weight and size reductions, and so on Integrated chip-flip, diode microtransformers can be mounted  with protrusions and downwards on layers mounted on electromechanical devices and attached to the IC base.  MEMS Large-scale integrated MEMS (a chip that  can be mass-produced) And at a low cost  used in COMS,

 


Conclusion : 

Recent trends in nanoelectronics engineering and science have focused on emphasizing the  combination, analysis, and control of advanced MEMS and NEMS  The processes of composition, design and optimization are in fact evolutionary over natural samples . 

Researcher  and author: Dr.   (   Afshin Rashid)

PhD in Nano-Microelectronics