(micro BGA patterning) and reconstruction of micro BGA bases
Researcher and author: ( Afshin Rashid)
Note: SMD stencils are used for rebuilding and rebalancing ICs on the base of the hub (under the base) or micro BGA. The tin paste from the pores (holes) of the stencil is perfectly arranged to allow the damaged IC bases to function again in the circuit. To stencil BGA IC, you need a hot air heater.
To reconstruct and reball ICs of ball base (sub-base) or tin paste micro BGA, taking into account its standard level of softness, on the template by a metal spatula (with the possibility of defining the amount of pressure and range of motion), from inside the hole Embedded on the SMD template is transferred to the micro BGA IC.
The increase in the number of inputs and outputs in ICs has caused the dimensions of the IC to increase, in order to increase the number of bases and reduce the dimensions of the IC, micro BGA technology is used . This chip model can be rebuilt or reballed. In this method, instead of IC bases around it, it is under the IC. In the bases, solder is used in the form of balls, which are soldered to the board after assembling these bases.
Micro BGA ICs can be easily reused by stenciling. This chip model is a type of SMD IC that is used in many electronic devices such as mobile phones and telecommunication equipment, computer motherboards and many other electronic boards. Because this AC does not have anything called a base, which means it does not have a hard base like other DIP or SMD ACs, and its bases are made of tin, and these bases are placed exactly on the bottom of the AC; To replace, we need a heater; For this purpose, we use a body heater, but for sensitive chips like the motherboard, an infrared heater can be used.