Micro BGA or Micro BGA section
Micro BGA type TF_BGA (more base and compact)
Researcher and author: Dr. ( Afshin Rashid)
Note: In ICs and BGA chips (hub base), instead of the IC bases being around it, it is under the IC. In the bases, solder is used in the form of balls, which are soldered to the board after assembling these bases.
This chip model is a type of SMD IC. which is used in many electronic devices such as mobile phones and telecommunication equipment, computer motherboards and many other cases in electronic boards. Because this AC does not have a base, which means it does not have a hard base like other DIP or SMD ACs. And its bases are made of tin, and these bases are placed exactly in the bottom of AC; To replace, we need a heater; For this purpose, we use a body heater, but for sensitive chips like the motherboard, an infrared heater can be used.
BGA chips have many advantages, and as a result, they are increasingly used in the construction of electrical circuits. The hub network array, due to the need to have a stronger and more suitable package for the construction of integrated circuits with a large number of pins, the BGA package Was made. As integration levels increase, some integrated circuits have as many as 100 pins.
Researcher and author: Dr. ( Afshin Rashid)
Specialized doctorate in nano-microelectronics