_ Understanding ( Micro BGA ICs) or (Micro Ball Base)
Micro BGA or micro ball base TF_BGA review (more and more bases)
Researcher and Author: Dr. ( Afshin Rashid)
Note: In ICs and BGA chips, the IC pins are located underneath the IC instead of around it. The pins are soldered in the form of balls, which are soldered to the board after assembly.
This chip model is a type of SMD IC. It is used in many electronic devices such as mobile phones and telecommunications equipment, computer motherboards and many other electronic boards. Because this IC does not have a base, which means it does not have a hard base like other DIP or SMD ICs, and its bases are made of tin and these bases are located exactly at the bottom of the IC; to replace it, we need a heater; for this, we use an air heater, but for sensitive chips such as motherboards, an infrared heater can be used.
BGA chips have many advantages and are therefore increasingly used in the manufacture of electrical circuits. The ball grid array was developed due to the need for a stronger package that is more suitable for the manufacture of integrated circuits with a large number of pins. With increasing levels of integration, some integrated circuits have over 100 pins.
Researcher and Author: Dr. ( Afshin Rashid)
Specialized PhD in Nano-Microelectronics