Micro BGA ( Micro Ball Grid Array ) Internal Structure and Construction

_ Understanding ( Micro BGA ICs) or (Micro Ball Base)

^{Micro BGA ( Micro  Ball Grid Array  ) Internal Structure and Construction}

• Researcher  and Author: Dr.   (   Afshin Rashid)

• 

^{Note: Ball grid technology is a type of surface mount technology or SMT package, so it is used in many integrated circuits today. BGA has many advantages and is therefore increasingly used in the manufacture of electrical circuits.}

^{The ball grid array (BGA) package was developed due to the need for a stronger package that was more suitable for manufacturing integrated circuits with a large number of pins.}

^{Three main advantages that BGA and micro BGA chip structures offer:} 

1. ^{1.  High density  . BGAs are a solution for producing miniature packages for integrated circuits with hundreds of pins. BGAs do not have the problem of adjacent pins sharing when factory soldered onto the package.}
2. ^{2.  Heat transfer  . BGA packages with discrete edges (i.e., packages with legs) have lower thermal resistance between the package and the PCB. This allows the heat generated by the integrated circuit inside the package to flow more easily to the PCB, preventing the chip from overheating.}
3. ^{3-  Low inductance leads  . BGAs have low inductance with a very small distance between the package and the PCB and therefore have much better electrical performance than leaded devices.}
4. 
   

 ^{Note:  Micro BGA has lower current for micro ball grid array (BGA) connection with less groove. Assembly services use mixed technologies such as chip and wire and use microelectronic assembly equipment in a clean room environment.}

^{The BGA uses a different approach than the one used in most common surface mount connections in the past. Other packages, such as the Quad Flat Package (QFP), use the perimeter of the package for connections. This means that there is limited space for the pins to be close together and must be very small to provide the desired level of connectivity. The BGA uses the bottom of the package, where there is considerable space for connections.}

^{General structure of the chip: Material of the silicon mold; Half-ball base (material of tin; tin paste); Type of base under the chip in an array; Type of connection and placement (heating by heater and flex oil or BGA machine)}

^{BGA chips have many advantages and are increasingly used in the manufacture of electrical circuits.}

^{The ball grid array was developed due to the need for a stronger package that is more suitable for the manufacture of integrated circuits with a large number of pins. As the level of integration increases, some integrated circuits have over 100 pins.}

• • Researcher  and Author: Dr.   (   Afshin Rashid)

  • Specialized PhD in Nano-Microelectronics