Examining the internal structure and construction of a micro BGA (ball grid array) (please pay more attention to the article)

_ Understanding ( Micro BGA ICs) or (Micro Ball Base)

^{Examining the internal structure and construction of a micro BGA (ball grid array)  (please pay more attention to the article)}

• Researcher  and Author: Dr.   (   Afshin Rashid)

^{Note: Micro BGA ball grid array technology is a type of surface mount technology or SMT package, so it is used in many integrated circuits today. Micro BGA has many advantages and is therefore increasingly used in the manufacture of electrical circuits.}

^{The ball grid array, or BGA, was developed due to the need for a stronger package that was more suitable for manufacturing integrated circuits with a high number of pins.}

^{Three main advantages that micro BGA chip structures offer:} 

1. ^{1-  High density  . Micro BGAs are a solution for producing miniature packages for integrated circuits with hundreds of pins. Micro BGAs do not have the problem of adjacent pins sharing when factory soldered onto the package.}
2. ^{2.  Heat transfer  . Micro BGA packages with discrete edges (i.e., packages with legs) have lower thermal resistance between the package and the PCB. This allows the heat generated by the integrated circuit inside the package to flow more easily to the PCB, preventing the chip from overheating.}
3. ^{3-  Low inductance leads  . Micro BGAs have low inductance with a very small distance between the package and the PCB and therefore have much better electrical performance than leaded devices.}

 ^{Note:  Micro BGA has lower current for micro ball grid array (BGA) connection with less groove. Assembly services use mixed technologies such as chip and wire and use microelectronic assembly equipment in a clean room environment.}

^{The micro BGA uses a different approach than the one used in most conventional surface mount connections. Other packages, such as the quad flat package (QFP), use the perimeter of the package for connections. This means that there is limited space for the pins to be close together and must be very small to provide the desired level of connectivity. The micro BGA uses the bottom of the package, where there is considerable space for connections.}

^{General structure of the chip: Material of the silicon mold; Half-ball base (material of tin; tin paste); Type of base under the chip in an array; Type of connection and placement (heating by heater and flex oil or BGA machine)}

^{Micro BGA chips have many advantages and are therefore increasingly used in the manufacture of electrical circuits. The ball grid array was developed due to the need for a stronger package that is more suitable for the manufacture of integrated circuits with a large number of pins. With increasing levels of integration, some integrated circuits have over 100 pins.}

Researcher  and Author: Dr.   (   Afshin Rashid)

Specialized PhD in Nano-Microelectronics