Micro BGA of WCSP type (smaller than micro BGA)

Micro BGA or Micro BGA section 

Micro BGA of WCSP type (smaller than micro BGA)

Researcher  and author: Dr.   (   Afshin Rashid)

Note: WCSP IC  has a lower current for micro ball grid connection (BGA) with less slot. The assembly service uses mixed technologies such as chip and wire and uses microelectronic assembly equipment in a clean room environment.

_{The BGA hub grid array uses a different method than that used in most common surface mount connectors in the past. Other packages, such as QFP, use the perimeter of the package for connections. This means that there is a limited amount of space for the pins to be close together and must be very small to provide the expected level of connectivity. A BGA hub array uses the bottom of the package, where there is considerable space for connections. The ball grid array was created due to the need to have a stronger and more suitable package for making integrated circuits with a large number of pins.}

Three main advantages that the WCSP _{chip structure   provides:}

 _{_  High density  . BGAs are a solution to produce miniature packages for integrated circuits with hundreds of pins. BGAs do not have the problem of common adjacent pins when factory soldered on the package.}

_  Heat transfer  . BGA packages with discrete edges (ie packages with feet) have lower thermal resistance between the package and the PCB. This allows the heat generated by the integrated circuit inside the package to flow more easily to the PCB and prevents overheating of the chip.

_  It leads to low inductance  . BGAs have very little inductance with a very small distance between the package and the PCB, and therefore have much better electrical performance than conductive devices.

BGA chips have many advantages, and as a result, they are increasingly used in the construction of electrical circuits. The hub network array, due to the need to have a stronger and more suitable package for the construction of integrated circuits with a large number of pins, the BGA package Was made. As integration levels increase, some integrated circuits have as many as 100 pins.

Researcher  and author: Dr.   (   Afshin Rashid)

Specialized doctorate in nano-microelectronics