Micro BGA or (micro bga) how to use and function
Author and researcher : Dr. (Afshin Rashid)
Note: This chip model can be rebuilt or reballed.
What are Micro BGA ICs ?
The increase in the number of inputs and outputs in ICs has caused the dimensions of the IC to increase, in order to increase the number of bases and reduce the dimensions of the IC, micro BGA technology is used . In this method, instead of IC bases around it, it is under the IC.
In the bases, solder is used in the form of balls, which are soldered to the board after assembling these bases.
The operation and structure of micro BGA chip
There should be no holes under the base of this IC because the base will not be soldered properly.
Via is used between the IC pads . which is in the following two ways.
First method: In this method, Vias are placed between horizontal or vertical bases
Second method: In this method, Vias are placed between four IC pads.
In order not to have any problems in assembling the IC and not to have a short circuit between the via and the base , green printing should be done on the vias . Tenting option should be selected in Protel software in Via specifications.
Ayman chip model is a type of SMD IC that is used in many electronic devices such as mobile phones and telecommunications equipment, computer motherboards and many other places in electronic boards. Because this AC does not have a base, which means it does not have a hard base like other DIP or SMD ACs, and its bases are made of tin, and these bases are placed exactly on the bottom of the AC; To replace, we need a heater; For this purpose, we use air heaters , but for sensitive chips such as motherboards, IR optical heaters ( infrared heaters ) can be used.
