_ Understanding ( Micro BGA ICs) or (Micro Ball Base)
What are Micro BGA or (Micro BGA) ICs ? Micro BGA or (Micro bga) ICs How they are used and function
Author and researcher : Dr. (Afshin Rashid)
Note: This chip model can be rebuilt or reballed.
What are micro BGA ICs ?
The increase in the number of inputs and outputs in ICs has caused the IC dimensions to increase. In order to both increase the number of pins and reduce the IC dimensions, micro BGA technology is used. In this method, the IC pins are under the IC instead of around it.
The bases use solder in the form of balls, which are soldered to the board after assembly.
How BGA microchips work and build
There should be no holes under the base of this IC because the base will not be soldered properly.
Via is used between IC pads , which comes in two forms:
Method 1: In this method , vias are placed between horizontal or vertical legs.
Second method: In this method, Vias are placed between four IC pads.
To avoid problems during IC assembly and to prevent short circuits between the via and the base, the vias must be printed in green. In the Protel software, the Tenting option must be selected in the Via specifications.
The chip model is a type of SMD IC that is used in many electronic devices such as mobile phones and telecommunications equipment, computer motherboards, and many other places on electronic boards.
Because this IC does not have a base, meaning it does not have a hard base like other DIP or SMD ICs, and its bases are made of tin, and these bases are located exactly on the bottom of the IC;
To replace, we need a heater; for this we use an air heater , but for sensitive chips like motherboards, IR optical heaters ( infrared heaters ) can be used.
Note: The most important point of the heater in replacing micro BGA chips is to adjust its temperature, which must be adjusted based on experience and the number of IC pins, the adhesiveness of the IC, whether they are double-layered, etc. This is an experimental matter, and if the IC reaches a high temperature, the entire chip will be destroyed and cannot be used.
Researcher and Author: Dr. ( Afshin Rashid)
Specialized PhD in Nano-Microelectronics