Micro BGA or (micro bga)  how to use and function 

Author and researcher : Dr. (Afshin Rashid)


Note: This chip model can be rebuilt or reballed.

What are Micro BGA ICs   ?

The increase in the number of inputs and outputs in ICs has caused the dimensions of the IC to increase, in order to increase the number of bases and reduce the dimensions of the IC, micro BGA technology is  used  In this method, instead of IC bases around it, it is under the IC.

 In the bases, solder is used in the form of balls, which are soldered to the board after assembling these bases.

 


The operation and structure of micro BGA chip

 There should be no holes under the base of this IC because the base will not be soldered properly.

Via is used  between the IC pads  . which is in the following two ways.

First method: In this method,  Vias  are placed between horizontal or vertical bases 

Second method: In this method,  Vias  are placed between four IC pads.

 In order not to have any problems in assembling the IC and   not to have a short circuit  between the via and the base  , green printing should be done on the vias . Tenting  option should  be selected in Protel software in  Via specifications.

Application of micro BGA chips

Ayman chip model is a type of SMD IC that is used in many electronic devices such as mobile phones and telecommunications equipment, computer motherboards and many other places in electronic boards. Because this AC does not have a base, which means it does not have a hard base like other DIP or SMD ACs, and its bases are made of tin, and these bases are placed exactly on the bottom of the AC;  To replace, we need a heater; For this purpose,  we use air heaters  , but for sensitive chips such as motherboards,  IR optical heaters  (  infrared heaters  ) can be used.



Note:  The most important point of the heater in replacing micro BGA chips is to adjust its temperature. which should be adjusted based on experience and the number of IC bases, the adhesiveness of the IC, their two-layeredness, etc. This is an experimental matter and if the IC reaches a high temperature, the entire chip will be destroyed and can no longer be used.

Researcher  and author: Dr.   (   Afshin Rashid)
Specialized doctorate in nano-microelectronics