Micro BGA or Micro BGA section
The so-called ball grid array (BGA packages) _ microelectronics / very important, please pay attention
Researcher and author: Dr. ( Afshin Rashid)
Note: BGA is an abbreviation of ball grid array.
This IC model is almost like CPU ICs; SMD hub grid array BGA packages provide high-density connections for easy manufacturing of integrated circuits, as they allow the underside of a chip package to be used for connections. Hub network technology is a type of surface mounting technology or SMT package, so that it is used in many integrated circuits today. The grid pattern of BGA boards is somewhat like the pins are arranged in a grid pattern below the surface of the chip (hence the name hub grid array), also instead of using pins for connection, pads with copper hubs are used as the connection method. On the printed circuit board, PCB, on which the BGA device is properly mounted, there is a coordinated set of copper pads to provide the required connection.
Aside from improved connectivity, BGAs have other benefits. They have lower thermal resistance in the silicon chip than the square flat package. This makes the heat generated inside the integrated circuit transfer faster and more effectively from the device to the PCB. In this way, in BGAs, it is possible to generate more heat without the need for special coolers.
Note: The way of placing BGA ICs is done with low heat and high accuracy due to the presence of ball bases under the IC using a heater.
This type of IC is mostly used in smart circuits; Robotics and laptops are used, but it is also used in general.
Researcher and author: Dr. ( Afshin Rashid)
Specialized doctorate in nano-microelectronics