The structure and internal structure of micro BGA (ball base) Micro ball grid array

Micro BGA or Micro BGA section 

^{The structure and internal structure of micro BGA (ball base) Micro ball grid array (please pay more attention to the article)}

• Researcher  and author: Dr.   (   Afshin Rashid)

^{Note: Micro BGA hub network technology is a type of surface mounting technology or SMT package, so that it is used in many integrated circuits today. Micro BGA has many advantages and as a result, it is increasingly used in the construction of electrical circuits.}

^{Because of the need to have a stronger and more suitable package for making integrated circuits with a large number of pins, the micro BGA package was made.}

^{Three main advantages that the micro BGA chip structure offers:} 

1. ^{1-  High density  . Micro BGAs are a solution to produce miniature packages for integrated circuits with hundreds of pins. Micro BGAs do not have the common issue of adjacent pins when factory soldered on the package.}
2. ^{2-  Heat transfer  . Micro BGA packages with discrete edges (ie packages with feet) have lower thermal resistance between the package and the PCB. This allows the heat generated by the integrated circuit inside the package to flow more easily to the PCB, preventing the chip from overheating.}
3. ^{3-  It leads to low inductance  . Micro BGAs have very little inductance, with very little gap between the package and the PCB, and therefore have much better electrical performance than conductive devices.}

 ^{Note:  Micro BGA has a lower current for micro ball grid connection (BGA) with less groove. The assembly service uses mixed technologies such as chip and wire and uses microelectronic assembly equipment in a clean room environment.}

^{The micro BGA hub grid array uses a different method than that used in most common surface mount connectors in the past. Other packages, such as QFP, use the perimeter of the package for connections. This means that there is a limited amount of space for the pins to be close together and must be very small to provide the expected level of connectivity. The micro-BGA hub grid array uses the bottom of the package, where there is considerable space for connections.}

^{The general structure of the chip: silicon mold material; half-ball base (tin material; tin paste); Base type under the chip as an array; Type of connection and placement (heated by a heater and flex oil or BGA car)}

^{Micro BGA chips have many advantages, and as a result, they are increasingly used in the construction of electrical circuits. The hub network array, because of the need to have a stronger and more suitable package for the construction of integrated circuits with a large number of pins, made a micro BGA package. became. As integration levels increase, some integrated circuits have as many as 100 pins.}

Researcher  and author: Dr.   (   Afshin Rashid)

Specialized doctorate in nano-microelectronics