Micro BGA or Micro BGA section
Micro BGA _ Micro type (Q _ Micro BGA)
Researcher and author: Dr. ( Afshin Rashid)
Note: The increase in the number of inputs and outputs in ICs has caused the dimensions of the IC to increase in order to increase the number of bases and reduce the dimensions of the IC. Micro BGA technology is used . This chip model can be rebuilt or reballed.
In this method, instead of IC bases around it, it is under the IC. In the bases, solder is used in the form of balls, which are soldered to the board after assembling these bases.
Micro BGA operation and construction
There should be no holes under the base of this IC because the base will not be soldered properly. Via is used between the IC pads . which is in the following two ways.
First method: In this method, Vias are placed between horizontal or vertical bases.
Second method: In this method, Vias are placed between four IC pads.
In order not to have any problems in assembling the IC and not to have a short circuit between the via and the base , green printing should be done on the vias . Tenting option should be selected in Protel software in Via specifications.
This chip model is a type of SMD ICs. which is used in many electronic devices such as mobile phones and telecommunication equipment, computer motherboards and many other places in electronic boards. Because this AC does not have a base, which means it does not have a hard base like other DIP or SMD ACs. And its bases are made of tin, and these bases are placed exactly in the bottom of AC; To replace, we need a heater; For this purpose, we use a body heater, but for sensitive chips like the motherboard, an infrared heater can be used.
Micro BGA has lower current for micro ball grid (BGA) connection with less groove. The assembly service uses mixed technologies such as chip and wire and uses microelectronic assembly equipment in a clean room environment. The BGA hub grid array uses a different method than that used in most common surface mount connectors in the past. Other packages, such as QFP, use the perimeter of the package for connections. This means that there is limited space for the pins to be close together and must be very small to provide the expected level of connectivity. The BGA hub array uses the bottom of the package, where there is considerable space for connections.
Researcher and author: Dr. ( Afshin Rashid)
Specialized doctorate in nano-microelectronics