_ Understanding ( Micro BGA ICs) or (Micro Ball Base)

More about Micro BGA (Micro Ball Grid Array) chips 

Researcher  and Author:  Dr. (   Afshin Rashid)

Note:  Micro BGA has lower current for micro ball grid array (BGA) connection with less groove. Assembly services use mixed technologies such as chip and wire and use microelectronic assembly equipment in a clean room environment.



The BGA uses a different approach than that used in most conventional surface mount connections. Other packages, such as the quad flat package (QFP), use the perimeter of the package for connections. This means that there is limited space for the pins to be close together and they must be very small to provide the desired level of connectivity. The BGA uses the bottom of the package, where there is considerable space for connections. The  BGA package was developed due to the need for a stronger package that was more suitable for manufacturing integrated circuits with a high pin count.



Three main advantages that micro BGA chip structures offer:

 _  High density  .  BGAs are a solution for producing miniature packages for integrated circuits with hundreds of pins.  BGAs do not have the problem of adjacent pins sharing when factory soldered onto the package.

_  Heat transfer  . BGA packages with discrete edges (i.e., packages with legs) have lower thermal resistance between the package and the PCB. This allows the heat generated by the integrated circuit inside the package to flow more easily to the PCB, preventing the chip from overheating.

_  Low inductance leads  . BGAs have low inductance with very little distance between the package and the PCB and therefore have much better electrical performance than leaded devices.

BGA chips have many advantages and are therefore increasingly used in the manufacture of electrical circuits. The ball grid array was developed due to the need for a stronger package that is more suitable for the manufacture of integrated circuits with a large number of pins. With increasing levels of integration, some integrated circuits have over 100 pins.

  • Researcher  and Author: Dr.   (   Afshin Rashid)

  • Specialized PhD in Nano-Microelectronics