_ Department of systems (nano and microelectric and mechanical  MEMS ) 

MEMS (abbreviation of nano electrical mechanical systems) or  Nano electronical systems (a final summary of the topic)

Researcher  and author: Dr.   (   Afshin Rashid)



Note: Different MEMS and NEMS must be designed according to the specifications, needs, goals and applications. Electromechanical and electromechanical MEMS and NEMS have been developed. Generally, optical systems are faster, simpler, more efficient, more reliable, and more durable than electromechanical systems.

 Although optical systems  are designed for different applications (such as: communications, calculations and  wireless keying, etc.),  they have different configurations, in general it is very difficult to  make a comparative comparison between them. For example,  optical systems cannot be used as stimuli  . Application needs should be counted and  electromagnetic connections, temperature, vibration or   radiation can be factors used for  better construction. As another example, let  's look at nano and micro scale stimuli. The size of the actuator depends on the amount of force or torque that is a function of the material used and its size (volume). In fact, the size with the required power and torque and its material Determined. It is very important that the electromagnetic MEMS integrates microstructures or microtrans-diodes that are controlled by ICs used in micro-devices of radiant energy. In this way, microstructures and microtrans-diodes, radiant energy devices and ICs must be integrated. The technology of direct chip connection has advanced greatly. In particular, the chip-flip MEMS array was replaced with a wire strip to connect to ICs with micro-nano scale actuators and sensors. The use of chip-flip technology makes it possible to eliminate parasitic inductors, capacitors, and resistors. 


This issue leads to the modification of the device's specifications. In the continuation of chip-flip integration, it leads to advantages in the implementation of advanced flexible packages, reliable improvements and reduction of weight and size, etc. integrated chip - flip, microtransdiodes can be mounted with the raised and facing down on layers that are mounted on electromechanical devices and connected to the base of the IC Large-scale integrated MEMS (a chip that can be mass-produced And with a low cost that is used in COMS.



Conclusion : 

Different architectures and configurations can be combined. One of the users of MEMS and NEMS is the control of complex systems, processes and phenomena. In order to control the systems, many decision-making tasks and variables (states, outputs, events, etc.) must be measured. This means that it must be implemented and sensed (by means of micro-transducers of the society). In ICs and radiant energy devices), calculations, communications, network-related tasks, signal processing and other actions must be performed.

Researcher  and author: Dr.   (   Afshin Rashid)

Specialized doctorate in nano-microelectronics